JPH0741170Y2 - 発光ダイオードランプ - Google Patents

発光ダイオードランプ

Info

Publication number
JPH0741170Y2
JPH0741170Y2 JP1989094568U JP9456889U JPH0741170Y2 JP H0741170 Y2 JPH0741170 Y2 JP H0741170Y2 JP 1989094568 U JP1989094568 U JP 1989094568U JP 9456889 U JP9456889 U JP 9456889U JP H0741170 Y2 JPH0741170 Y2 JP H0741170Y2
Authority
JP
Japan
Prior art keywords
light emitting
lead wire
emitting diode
wiring
diode lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989094568U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0334258U (en]
Inventor
俊行 沢田
真吾 川上
邦彦 博田
準 光井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Tottori Sanyo Electric Co Ltd
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tottori Sanyo Electric Co Ltd, Sanyo Electric Co Ltd filed Critical Tottori Sanyo Electric Co Ltd
Priority to JP1989094568U priority Critical patent/JPH0741170Y2/ja
Publication of JPH0334258U publication Critical patent/JPH0334258U/ja
Application granted granted Critical
Publication of JPH0741170Y2 publication Critical patent/JPH0741170Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
JP1989094568U 1989-08-11 1989-08-11 発光ダイオードランプ Expired - Lifetime JPH0741170Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989094568U JPH0741170Y2 (ja) 1989-08-11 1989-08-11 発光ダイオードランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989094568U JPH0741170Y2 (ja) 1989-08-11 1989-08-11 発光ダイオードランプ

Publications (2)

Publication Number Publication Date
JPH0334258U JPH0334258U (en]) 1991-04-04
JPH0741170Y2 true JPH0741170Y2 (ja) 1995-09-20

Family

ID=31643889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989094568U Expired - Lifetime JPH0741170Y2 (ja) 1989-08-11 1989-08-11 発光ダイオードランプ

Country Status (1)

Country Link
JP (1) JPH0741170Y2 (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005136224A (ja) * 2003-10-30 2005-05-26 Asahi Kasei Electronics Co Ltd 発光ダイオード照明モジュール

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5353421Y2 (en]) * 1972-12-27 1978-12-20
JPS5571569U (en]) * 1978-11-07 1980-05-16
JPS5930540Y2 (ja) * 1979-07-24 1984-08-31 三洋電機株式会社 発光ダイオ−ドランプ
JPS5839063U (ja) * 1981-09-08 1983-03-14 三洋電機株式会社 全色発光半導体装置
JPS60102775A (ja) * 1983-11-09 1985-06-06 Toshiba Corp 発光表示装置
JPS6151763U (en]) * 1984-09-10 1986-04-07
JPS61179003A (ja) * 1985-02-04 1986-08-11 スタンレー電気株式会社 車両用灯具の光源
JPS624380A (ja) * 1985-06-29 1987-01-10 Toshiba Corp 発光ダイオ−ド装置
JPH0192684U (en]) * 1987-12-10 1989-06-16
JPH01157577A (ja) * 1987-12-14 1989-06-20 Mini Pairo Denki:Kk 半導体発光装置

Also Published As

Publication number Publication date
JPH0334258U (en]) 1991-04-04

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term